Cooling requirements of AI server BBU

With the rapid improvement of AI computing power, the energy consumption of AI servers continues to increase, placing higher demands on cooling systems. This article will explore the cooling requirements and challenges of AI server BBU (Baseband Unit).

Cooling requirements

1. High-efficiency heat dissipation : AI server chips generate a significant amount of heat during operation, which traditional air cooling can no longer meet. Liquid cooling technology has become the primary solution, with dual-phase immersion cooling systems receiving particular attention because they provide efficient heat dissipation, keeping the chips operating within an appropriate temperature range.
2. Stable Operation : Ensuring stable operation of AI servers under high load is crucial. Overheating can lead to performance degradation or even chip damage. Therefore, the cooling system must be able to continuously and effectively dissipate heat to prevent overheating.
3. Energy conservation and carbon reduction : As energy consumption in global data centers continues to rise, energy conservation and carbon reduction have become important goals. High-efficiency cooling technologies can significantly reduce energy consumption and carbon emissions, promoting the development of green data centers.

Inventec’s immersion cooling technology

Current AI servers face the challenge of generating significant heat from high-performance computing, making proper cooling solutions crucial for ensuring stable server operation. The THERMASOLV™ series from Inventec Performance Chemicals, distributed by Tong Mei Corporation, is designed to meet the demands of today’s and future technologies, offering a high-performance, safe, and environmentally friendly solution.

THERMASOLV™ Series Product Features

1. High heat transfer efficiency : These dielectric fluids have excellent heat transfer efficiency, effectively removing the heat generated by AI servers during high-performance computing.
2. Excellent electrical insulation performance : The THERMASOLV™ series products have excellent electrical insulation performance, ensuring that the electrical components of the server will not be damaged during the cooling process.
3. Safety and environmental protection : These dielectric fluids take into account safety during use and environmental impact, making them an environmentally friendly and safe cooling solution.
4. Material compatibility : These products are compatible with a wide range of materials, ensuring stable operation in different server configurations.

Immersion cooling technology

The provided immersion cooling technology is ideal for high-performance computing and data center applications, and includes the following two types:

1. Single-phase immersion cooling : This method uses a liquid dielectric coolant to directly contact electronic equipment, allowing heat to be removed through natural convection. This reduces energy consumption and operating costs.
2. Two-phase immersion cooling : The liquid dielectric coolant absorbs heat, transforms into a gaseous state, and then condenses back into a liquid state to achieve cooling. This method is suitable for situations with higher heat loads.

The THERMASOLV™ series of products and immersion cooling technology, distributed by Tong Mei Corporation, meet the cooling needs of AI server BBUs, providing stable operation and long-term reliability. These technologies not only offer efficient thermal management but also reduce energy consumption, which is crucial for modern data centers seeking energy efficiency and sustainability.