Trend Forecast: Industry Pulse, New Product and Event Updates

As AI chips propel us into the era of high-density heterogeneous integration and Advanced Packaging, the semiconductor manufacturing process demands an unprecedented level of "extreme cleanliness," "high thermal performance," and "chemically compliant sustainable materials."

At this year's SEMICON Taiwan, Toung Mei Corporation (TMC) is partnering with Inventec Performance Chemicals, a global expert in high-tech electronic and semiconductor materials, to showcase four major material defense lines that fully comply with future semiconductor specifications. Moving beyond just supplying materials, we will demonstrate through real-time, on-site data how to maximize your final yield while seamlessly achieving a green transition across your semiconductor supply chain.

Tongmei Enterprise, in collaboration with INVENTEC, is leading the liquid cooling revolution in 2026, demonstrating single-phase and two-phase immersion-grade solvents on-site. Through 2D PLC intelligent equipment, the high insulation and low volatility of the solvents are quantified in real time. We use real-world data to prove that high-quality solvents combined with precise monitoring can ensure that AI devices remain stable, long-lasting, and environmentally friendly even under extreme heat dissipation conditions.