Driving Next-Gen Packaging & Green Yield: TMC Partners with Inventec to Showcase at SEMICON Taiwan!
As AI chips propel us into the era of high-density heterogeneous integration and Advanced Packaging, the semiconductor manufacturing process demands an unprecedented level of "extreme cleanliness," "high thermal performance," and "chemically compliant sustainable materials."
At this year's SEMICON Taiwan, Toung Mei Corporation (TMC) is partnering with Inventec Performance Chemicals, a global expert in high-tech electronic and semiconductor materials, to showcase four major material defense lines that fully comply with future semiconductor specifications. Moving beyond just supplying materials, we will demonstrate through real-time, on-site data how to maximize your final yield while seamlessly achieving a green transition across your semiconductor supply chain.
Four Major Semiconductor Technology Zones: From Back-End Wafer Processing to End-Use Protection
1. Advanced Cleaning ｜ High Yield & PFAS-Free Green Transition
In advanced packaging (such as CoWoS and other heterogeneous integration technologies), the spacing between bumps and microbumps is extremely narrow, making flux residue highly prone to entrapment.
- High-Precision Semiconductor Cleaning: On-site demonstrations will feature high-precision aqueous and solvent-based cleaning agents designed for advanced packaging and high-density SMT processes. These solutions thoroughly penetrate micro-gaps, ensuring extreme cleanliness to significantly boost back-end wafer yields.
- Greenway Sustainable Specialty Chemicals: Inventec’s formulations have been entirely free of CMR (Carcinogenic, Mutagenic, or toxic for Reproduction) substances since 2006. The eco-friendly cleaning solutions showcased on-site not only fully comply with REACH regulations but also serve as your strongest backbone for implementing a PFAS-Free transition in your manufacturing process and passing ESG audits from top-tier international manufacturers.
2. Thermal Management & Cooling ｜ Wafer Testing & High-Power Chip Dissipation
Wafer Testing and high-power AI chips demand exceptionally stringent temperature controls.
- Dielectric Cooling Fluids: We will showcase high-purity, high-insulation dielectric cooling fluids tailored for precise temperature control in semiconductor testing equipment, as well as immersion cooling dissipation for high-power chips.
- On-Site One-Phase & Two-Phase Demonstrations: Both single-phase and two-phase cooling technologies will be demonstrated simultaneously, proving how their superior chemical stability and low evaporation rates ensure absolute stability in testing environments and system operations.
3. Advanced Soldering ｜ Next-Gen Microelectronics Assembly
- Semiconductor Packaging Specialty Solder Pastes & Fluxes: Engineered for miniaturized, high-density semiconductor packaging processes, these ultra-low residue materials offer excellent wetting and anti-voiding performance. They guarantee the long-term reliability of solder joints under extreme operational environments.
4. Conformal Coatings ｜ End-Use Protection for Harsh Environments
- Nano-scale & Ultra-Thin Protection: Discover Inventec’s exclusive ultra-thin nano coatings (Epilame) and high-end conformal coatings. They provide flawless protection against moisture, dust, and corrosion for automotive semiconductors and aerospace/defense chips, locking in the highest tier of chip reliability.
On-Site Monitoring, Proven by Data
Our booth features multiple semiconductor-grade precision sensors delivering real-time data outputs on dielectric strength, particle removal, and thermal resistance. Backed by nearly 60 years of industrial expertise and technical support, TMC uses the most rigorous data to prove that we are your most reliable green partner for next-generation semiconductor manufacturing.
“From advanced packaging cleaning and microelectronics soldering to thermal management testing, we safeguard every stage of semiconductor yield with top-tier chemical materials.”
📅 Exhibition Dates: September 2-4, 2026 (3 Days)
📍 Location: Taipei Nangang Exhibition Center, Hall 2, 4F
📌 Booth Number: S7852
🌐 Partner Technical Website: Inventec Performance Chemicals
✉️ Process Evaluation & Sample Inquiries: [email protected]
