all
all
Home>Semiconductor Process Chemicals>Cooling>

THERMASOLV CF2 : Ideal dielectric heat transfer fluid for single-phase immersion cooling systems

THERMASOLV CF2 is a high-performance dielectric heat transfer fluid specifically designed for single-phase immersion cooling and direct cooling systems . It removes heat through continuous liquid circulation, making it ideal for those seeking a stable , low-maintenance , and efficient thermal management solution, particularly suitable for data center , power electronics , and industrial cooling applications.
Suitable for temperatures ranging from ultra-low to high, ensuring long-term stability and efficient heat dissipation of critical electronic components in single-phase systems!
  • Dielectric heat transfer fluid
  • Boiling point: 110°C/230°F
  • No flashpoint & ultra-low GWP

Core Product Advantages

When replacing power components or reassembling heatsinks, residual thermal paste can severely impact heat transfer efficiency. CF2 offers a professional solution for this.

  • Powerful dissolves grease and silicone oil: Specifically designed for silicone oil substrates and metal oxide fillers commonly found in high thermal conductivity materials (TIM), it can quickly penetrate and emulsify residues.
  • Ensure the heat dissipation surface is flat: Thoroughly remove the old thermal interface material to ensure that the new thermal paste can bond with the heatsink in the thinnest and most uniform state to achieve the lowest thermal resistance.
  • No residue drying: It has excellent volatility and leaves no oil film or solvent spots on the surface after cleaning, avoiding contamination of subsequent coatings.

Safety & Environmental Commitment

CF2 offers superior compliance to meet the stringent requirements of Taiwan’s major technology companies for chemical safety and environmental sustainability.

  • Zero Ozone Depletion (Zero ODP): Completely free of ozone-depleting substances and in compliance with international environmental protection conventions.
  • Low Global Warming Potential (Low GWP): Significantly reduces carbon footprint and helps businesses achieve their Green Manufacturing goals.
  • Low toxicity and high safety: Free from harmful solvents such as nPB and TCE, making it more worker-friendly and compliant with the Taiwan Ministry of Labor’s priority chemical management regulations.
  • Non-flammable: Exhibits excellent safety under recommended operating conditions, reducing the risk of fire during storage and manufacturing processes.

Exceptional Performance

CF2 effectively optimizes process details in response to Taiwan’s strong power management and packaging testing capabilities.

  • Excellent material compatibility: It is not corrosive to commonly used heat sink materials such as aluminum (Al), copper (Cu) , ceramic substrates (DBC/AMB), and engineering plastic housings.
  • Suitable for both cold and hot cleaning: It can be used for manual wiping cleaning at room temperature, as well as vapor phase or immersion cleaning in automated equipment.
  • Excellent penetration: Even thermal paste hidden at the bottom of heat sink fins or in tiny gaps between components can be easily removed by CF2.

Cost optimization

Through professional cleaning methods, we help customers reduce maintenance costs.

  • Improve thermal management efficiency: Avoid increased thermal resistance due to incomplete cleaning, reduce the risk of chip frequency reduction or damage due to overheating, and extend the life of end products.
  • Reduced wasted time: CF2 dissolves faster than alcohol (IPA) or traditional solvents, significantly reducing repair or rework time.
  • Reduce consumable expenses: High-efficiency dissolving power means that only a small amount of solvent is needed to achieve the cleaning goal, optimizing the material procurement budget.

Application area 

  • AI Servers and Data Centers: Residual Cleaning During CPU/GPU Heatsink and Module Replacement.
  • Electric Vehicle (EV) Powertrain: Cleaning of the thermal interface between the IGBT power module and the heat sink.
  • Power Supply: Surface treatment of heat sinks and power components before assembly.
  • Communication base stations: Efficient maintenance and cleaning of the heat dissipation backplate of 5G base stations.

Health, safety and environment

THERMASOLV CF2 is a Greenway product.
THERMASOLV CF2 Greenway 29%

Main factors to reduce:

Human safety and health

  • Non-flammable, no flash point, and no EUH-phrases. 100% safe for storage and use in equipment.
  • Non-toxic, non-corrosive, and free of S risk phrases

Environmental protection and resource conservation

  • No environmental hazards: No environmentally related labeling.
  • Recyclable and reusable: ECOPROGRAM
  • Low viscosity: Reduces pump energy consumption

Comparison Table

THERMASOLV COOLING FLUIDS
PRODUCT THERMASOLV CF2 THERMASOLV CF3 THERMASOLV IM1 THERMASOLV IM2 THERMASOLV IM6 THERMASOLV IM7
ODP 0 0 0 0 0 0
GWP < 120 <108 320 < 10 20 55
Flash Point No No No No No No
Boiling Point (°C/°F) 110 / 230 120 / 248 61 / 142 49 / 120 47 / 117 76 / 169
Pour Point (°C/°F) -110/ - 166 -82 /-116 -135 / -211 -108 / -162 -117 / -179 -138 / -216
Critical Temperature (°C/°F) 285/545 285/545 195 / 383 169 / 336 170 / 337 210 / 410
Critical Pressure (Mpa) 5 X 2.23 1.88 2.21 2.01
Vapor Pressure (kPa) 1.9 1.5 27 33 35 16
Heat of vaporization (KJ/Kg) @BP 88 82.8 112 88 93 126
Liquid density (Kg/m3) 1815 1836 1520 1600 1600 1430
Kinematic viscosity (cSt) 1.35 1.27 0.38 0.4 0.36 0.43
Specific Heat (J/Kg-K) @25°C 1087 1034 1183 1103 1044 1220
Surface tension (dynes /cm²) 15 13 13.6 10.8 11.4 13.6
Dielectric strenght (KV) 39.4 > 35.7 28 > 40 79 > 25
Dielectric constant @ 1 kHz 1.79 2.09 7.4 1.84 1.88 7.3
Resistivity (Ohm-cm) 2,50E+15 > 1,00E+15 1,00E+09 1,00E+13 1,00E+15 1,00E+08
Thermal conductivity (W/m-K) 0.115 0.112 0.069 0.059 0.11 0.069
Water content spec (ppm) 15 15 50 10 10 100
Water solubility (ppm) < 10 < 10 95 10 < 10 92