THERMASOLV CF3 : Ideal dielectric heat transfer fluid for single-phase immersion cooling systems
THERMASOLV CF3 is a high-performance dielectric heat transfer fluid specifically designed for single-phase immersion or direct cooling systems. Its excellent electrical insulation properties allow electronic and electrical equipment to be directly immersed in the fluid while energized.
CF3 possesses ideal viscosity, density, and surface tension characteristics, enabling optimal surface contact and providing superior thermal conductivity. Furthermore, its chemical stability and excellent compatibility with a wide range of materials make it an ideal fluid for immersion cooling.
CF3 possesses ideal viscosity, density, and surface tension characteristics, enabling optimal surface contact and providing superior thermal conductivity. Furthermore, its chemical stability and excellent compatibility with a wide range of materials make it an ideal fluid for immersion cooling.
Master the ultra-wide temperature range (-65°C to 110°C)! A benchmark of single-phase immersion cooling performance, providing long-lasting stability for your core components.
- Dielectric heat transfer fluid
- Boiling point: 120°C/248°F
- No flashpoint & ultra-low GWP
Core Product Advantages
THERMASOLV™ CF3 has excellent chemical solubility and can handle even long-stored, deteriorated, or highly filled thermal interface materials.
- Ultimate dissolving power: Provides superior cleaning performance for high-performance silicone-based materials , non-silicone substrates , and thermally conductive materials containing a large amount of ceramic or metal powder.
- Handling dried residue: The softening ability of “cured” or hardened thermal paste due to high-temperature aging has been specially optimized to avoid surface damage caused by mechanical scraping.
- High boiling point stability: It has a higher boiling point, making it more stable in vapor phase cleaning or heated immersion processes, providing a longer chemical reaction time.
Safety & Environmental Commitment
While providing powerful cleaning capabilities, CF3 strictly adheres to environmental regulations in Taiwan and internationally for the high-end electronics manufacturing industry.
- Environmental friendliness indicators: It has zero ozone depletion (Zero ODP) and extremely low global warming potential (Low GWP) , fully in line with Taiwan’s ESG carbon reduction pathway and green procurement policy.
- Non-flammable safety design: It has no flash point under standard operating conditions, reducing the stringent requirements for the fire resistance rating of chemicals in semiconductor plants.
- Protecting worker health: Free from high-risk carcinogenic solvents such as nPB (n-propyl bromide) and TCE (trichloroethylene), and meets occupational safety and environmentally friendly production standards.
Exceptional Performance
To meet the extreme demands of major Taiwanese server manufacturers (such as Quanta and Wistron), the CF3 ensures an absolutely clean thermal path.
- Atomic-level cleanliness: Thoroughly removes micron-sized residual particles, ensuring that the new thermally conductive interface material can perfectly fill the micropores and achieve the lowest contact thermal resistance .
- Excellent wettability: Its extremely low surface tension allows it to penetrate into the tiny gaps between the heat sink fins and the package base, completely removing hidden oil and dirt.
- High material compatibility: It has excellent compatibility with aluminum, copper, stainless steel and high-temperature engineering plastics commonly used in power modules, and will not cause discoloration or corrosion of the metal.
Cost optimization
Through its “high efficiency and low loss” characteristics, it directly improves the production and maintenance efficiency of enterprises.
- Reduce cleaning time: The powerful formula reduces the time spent on repeated wiping or soaking, significantly improving the output efficiency of Rework sites.
- Reduced solvent waste: Higher physical stability means lower evaporation losses in open systems, significantly reducing annual chemical procurement costs.
- Reduce component scrap rate: Avoid poor heat dissipation caused by old residue, thereby reducing the risk of defective chips due to overheating.
Application area
THERMASOLV™ CF3 is the best partner for Taiwan’s core high-tech industries:
- AI and GPU server maintenance: Applying heavy-duty thermal paste to high-power processor cold plates.
- Electric Vehicle (EV) Inverters and Electronic Controls: Cleaning residual heat at the interface between SiC/IGBT modules and heat sinks.
- Industrial-grade frequency converters: for regular maintenance and thermal interface updates of high-voltage power supply components.
- 5G base station heat dissipation module: Ensures the long-term reliability of the heat dissipation system in high-temperature outdoor environments.
Health, safety and environment
THERMASOLV CF3 is a Greenway product.
Main factors to reduce:
Human safety and health
- Non-flammable, no flash point, and no EUH-phrases. 100% safe for storage and use in equipment.
- Non-toxic, non-corrosive, and free of S risk phrases
Environmental protection and resource conservation
- No environmental hazards: No environmentally related labeling.
- Recyclable and reusable: ECOPROGRAM
- Low viscosity: Reduces pump energy consumption
Comparison Table
THERMASOLV COOLING FLUIDS
| PRODUCT | THERMASOLV CF2 | THERMASOLV CF3 | THERMASOLV IM1 | THERMASOLV IM2 | THERMASOLV IM6 | THERMASOLV IM7 |
|---|---|---|---|---|---|---|
| ODP | 0 | 0 | 0 | 0 | 0 | 0 |
| GWP | < 120 | <108 | 320 | < 10 | 20 | 55 |
| Flash Point | No | No | No | No | No | No |
| Boiling Point (°C/°F) | 110 / 230 | 120 / 248 | 61 / 142 | 49 / 120 | 47 / 117 | 76 / 169 |
| Pour Point (°C/°F) | -110/ - 166 | -82 /-116 | -135 / -211 | -108 / -162 | -117 / -179 | -138 / -216 |
| Critical Temperature (°C/°F) | 285/545 | 285/545 | 195 / 383 | 169 / 336 | 170 / 337 | 210 / 410 |
| Critical Pressure (Mpa) | 5 | X | 2.23 | 1.88 | 2.21 | 2.01 |
| Vapor Pressure (kPa) | 1.9 | 1.5 | 27 | 33 | 35 | 16 |
| Heat of vaporization (KJ/Kg) @BP | 88 | 82.8 | 112 | 88 | 93 | 126 |
| Liquid density (Kg/m3) | 1815 | 1836 | 1520 | 1600 | 1600 | 1430 |
| Kinematic viscosity (cSt) | 1.35 | 1.27 | 0.38 | 0.4 | 0.36 | 0.43 |
| Specific Heat (J/Kg-K) @25°C | 1087 | 1034 | 1183 | 1103 | 1044 | 1220 |
| Surface tension (dynes /cm²) | 15 | 13 | 13.6 | 10.8 | 11.4 | 13.6 |
| Dielectric strenght (KV) | 39.4 | > 35.7 | 28 | > 40 | 79 | > 25 |
| Dielectric constant @ 1 kHz | 1.79 | 2.09 | 7.4 | 1.84 | 1.88 | 7.3 |
| Resistivity (Ohm-cm) | 2,50E+15 | > 1,00E+15 | 1,00E+09 | 1,00E+13 | 1,00E+15 | 1,00E+08 |
| Thermal conductivity (W/m-K) | 0.115 | 0.112 | 0.069 | 0.059 | 0.11 | 0.069 |
| Water content spec (ppm) | 15 | 15 | 50 | 10 | 10 | 100 |
| Water solubility (ppm) | < 10 | < 10 | 95 | 10 | < 10 | 92 |