THERMASOLV IM1 : Replaces 3M™ Novec™ 7100, a high-efficiency electrofluid designed specifically for single-phase immersion cooling.With its superior dielectric properties and ultra-low global warming potential (GWP), it provides a safe and sustainable thermal management solution for data centers and power electronics.
THERMASOLV™ IM1 is a high-performance dielectric heat transfer fluid specifically designed for single-phase immersion and direct cooling systems . It provides a superior and secure thermal management solution for data centers, edge computing, and power electronics applications requiring long-term stable operation and low maintenance costs.
With increasingly stringent global environmental regulations and the impending discontinuation of 3M™ Novec™ 7100 , THERMASOLV™ IM1 , as Inventec’s next-generation “Greenway” environmentally friendly fluid, is not only completely free of PFAS (per- and polyfluoroalkyl substances) but also possesses extremely low global warming potential (GWP < 1), making it the ideal choice for balancing high-performance equipment operation with achieving corporate sustainability (ESG) goals.
With increasingly stringent global environmental regulations and the impending discontinuation of 3M™ Novec™ 7100 , THERMASOLV™ IM1 , as Inventec’s next-generation “Greenway” environmentally friendly fluid, is not only completely free of PFAS (per- and polyfluoroalkyl substances) but also possesses extremely low global warming potential (GWP < 1), making it the ideal choice for balancing high-performance equipment operation with achieving corporate sustainability (ESG) goals.
The liquid does not boil; heat is dissipated through liquid circulation. The manufacturing process is simple and maintenance is easy, making it suitable for general high-power equipment.
- Dielectric heat transfer fluid
- Boiling point: 61°C/142°F
- No flashpoint & ultra-low GWP
Core Product Advantages
THERMASOLV™ IM1’s special formulation allows it to maintain strong chemical activity even during long-term operation, making it ideal for handling large-volume component cleaning.
- High flash point safety: With a high flash point (60℃), it significantly reduces the risk of fire when used in large-capacity cleaning tanks, and improves the safety level of the factory.
- Low evaporation loss: The slow evaporation rate means that the solvent can remain on the surface of the contaminants for a long time and will not be lost quickly in the open cleaning tank, which significantly saves materials.
- Powerful penetration and separation: Effectively breaks down polymer chains in high-fill-rate thermally conductive silicone greases and non-silicone thermally conductive adhesives, allowing metal oxide fillers to quickly separate from the substrate.
Safety & Environmental Commitment
While ensuring powerful cleaning capabilities, IM1 also meets the stringent chemical management requirements of the semiconductor supply chain.
- Low VOC and environmental compliance: Lower volatility helps reduce emissions of volatile organic compounds (VOCs), assisting businesses in meeting Taiwan’s Environmental Protection Administration’s air pollution control standards.
- Zero Ozone Depletion (Zero ODP): Harmless to the atmospheric environment and fully compliant with the Montreal Protocol.
- Mild operating environment: With extremely low odor and no high-risk halogen solvents, it provides a more friendly working environment for personnel working on the cleaning line for extended periods.
Exceptional Performance
IM1 offers a cost-effective clean path to meet the high capacity demands of Taiwan’s electronics manufacturing services (EMS) industry.
- Excellent material compatibility: It is very safe for lead frames, heat sinks, copper alloys and electronic-grade engineering plastics (such as PBT, PPS), and is suitable for handling complex components made of different materials.
- High load capacity: The solvent can absorb a large amount of residual thermal paste without quickly becoming saturated, extending the cycle of a single solution change (Bath Life).
- Diverse application methods: In addition to the most recommended immersion method , it is also suitable for ultrasonic cleaning or heavy manual wiping .
Cost optimization
IM1 directly reduces the operating costs of enterprises in the cleaning process through its physical advantages.
- Reduced solvent replenishment frequency: Low volatility minimizes solvent loss, which can significantly reduce chemical procurement budgets for large-scale production lines.
- Energy saving and consumption reduction: Due to its efficient room temperature dissolving power, it does not require heating the cleaning tank in most cases, saving considerable electricity costs.
- Reduced waste generation: A longer lifespan means less wastewater discharge and treatment costs.
Application area
- Electric vehicle (EV) battery module repair: Cleaning the residue of high-viscosity thermally conductive adhesive between large battery cells and heat sinks.
- High-end power supplies (Server Power): Degreasing and grease removal for the surfaces of high-power transformers and heat sinks before assembly.
- Industrial Automation and Frequency Converters: During routine maintenance, a large-scale cleaning of the heat dissipation interface of the high-voltage IGBT module is performed.
- Heat dissipation module manufacturing: Batch cleaning of thermally conductive materials that overflow during the production process.
Health, safety and environment
THERMASOLV IM2 is a Greenway product.
Main factors to reduce:
Human safety and health
- Non-flammable, no flash point, and no EUH hazard: 100% safe for use and storage in equipment.
- Non-toxic & Non-corrosive & No usage instructions required
Environmental protection and resource conservation
- Environmental protection: There are no environmental hazard labels.
- Recyclable and reusable: ECOPROGRAM
- Ultra-low GWP
Comparison Table
THERMASOLV COOLING FLUIDS
| PRODUCT | THERMASOLV CF2 | THERMASOLV CF3 | THERMASOLV IM1 | THERMASOLV IM2 | THERMASOLV IM6 | THERMASOLV IM7 |
|---|---|---|---|---|---|---|
| ODP | 0 | 0 | 0 | 0 | 0 | 0 |
| GWP | < 120 | <108 | 320 | < 10 | 20 | 55 |
| Flash Point | No | No | No | No | No | No |
| Boiling Point (°C/°F) | 110 / 230 | 120 / 248 | 61 / 142 | 49 / 120 | 47 / 117 | 76 / 169 |
| Pour Point (°C/°F) | -110/ - 166 | -82 /-116 | -135 / -211 | -108 / -162 | -117 / -179 | -138 / -216 |
| Critical Temperature (°C/°F) | 285/545 | 285/545 | 195 / 383 | 169 / 336 | 170 / 337 | 210 / 410 |
| Critical Pressure (Mpa) | 5 | X | 2.23 | 1.88 | 2.21 | 2.01 |
| Vapor Pressure (kPa) | 1.9 | 1.5 | 27 | 33 | 35 | 16 |
| Heat of vaporization (KJ/Kg) @BP | 88 | 82.8 | 112 | 88 | 93 | 126 |
| Liquid density (Kg/m3) | 1815 | 1836 | 1520 | 1600 | 1600 | 1430 |
| Kinematic viscosity (cSt) | 1.35 | 1.27 | 0.38 | 0.4 | 0.36 | 0.43 |
| Specific Heat (J/Kg-K) @25°C | 1087 | 1034 | 1183 | 1103 | 1044 | 1220 |
| Surface tension (dynes /cm²) | 15 | 13 | 13.6 | 10.8 | 11.4 | 13.6 |
| Dielectric strenght (KV) | 39.4 | > 35.7 | 28 | > 40 | 79 | > 25 |
| Dielectric constant @ 1 kHz | 1.79 | 2.09 | 7.4 | 1.84 | 1.88 | 7.3 |
| Resistivity (Ohm-cm) | 2,50E+15 | > 1,00E+15 | 1,00E+09 | 1,00E+13 | 1,00E+15 | 1,00E+08 |
| Thermal conductivity (W/m-K) | 0.115 | 0.112 | 0.069 | 0.059 | 0.11 | 0.069 |
| Water content spec (ppm) | 15 | 15 | 50 | 10 | 10 | 100 |
| Water solubility (ppm) | < 10 | < 10 | 95 | 10 | < 10 | 92 |