ECOFREC™ POP WS30 : Water-washable flux expert designed specifically for high-precision PoP packaging
Its superior stability and cleaning performance perfectly meet the stringent requirements for dip-dip processes and residue removal in semiconductor stacked packaging.
Core features
- Excellent dip stability : The flux film thickness remains highly consistent even under long-term continuous operation.
- Highly efficient water washing performance : Solder residues can be easily removed with deionized water, ensuring the packaging surface is extremely clean.
- Low void ratio performance : The optimized chemical formula effectively reduces the formation of voids inside the solder joint, improving connection reliability.
- Halogen-free environmentally friendly formula : Meets the highest level of industrial environmental standards and contains no intentionally added halogens.
Core Product Advantages
Through precise rheological control, we ensure that the soldering quality of each layer of the package is as precise as that of the first layer.
- Constant film thickness : The flux exhibits excellent stability in the storage tray, ensuring a uniform amount for each dip.
- Long service life : It can maintain stable performance for more than 8 hours on the equipment, greatly reducing the risk of production interruption.
- Strong wetting ability : Designed specifically for PoP applications, it can quickly activate the surface and promote perfect solder joint formation.
Safety & Environmental Commitment
Inventec is committed to providing environmentally friendly and operator-safe chemical solutions.
- Halogen-free guarantee : Developed according to ORH0 specifications to ensure that the product meets the requirements of halogen-free production lines.
- RoHS and REACH compliance : Fully compliant with EU environmental regulations, ensuring the compliance and security of the supply chain.
- Low smoke and low odor : Optimized chemical composition reduces harmful emissions during the welding process, improving the working environment.
Exceptional Performance
In high-density packaging, the removal of residues is crucial to quality, and this is precisely our strength.
- Deionized water cleaning : Residue can be removed simply by using deionized water, without the need for additional chemical cleaning agents.
- Zero risk of corrosion : After thoroughly removing residues, it effectively prevents electrochemical migration and long-term corrosion problems.
- Wide temperature control compatibility : It exhibits excellent cleaning convenience under different reflow soldering profiles.
Cost optimization
By optimizing process efficiency, we help customers minimize their total cost of ownership (TCO).
- High Yield : Extremely low void and welding defect rates, significantly reducing scrap and rework costs.
- Simplified cleaning process : The efficient water washing characteristics shorten the cleaning cycle and reduce the complexity of wastewater treatment.
- Easy to store : Recommended storage at 5°C to 10°C, with an extended shelf life of 12 months.
Application area
It is not limited to PoP, but extends to a variety of precision microelectronic packaging scenarios.
- Package stack (PoP) : Optimized for dip applications in the chip stacking and soldering process of chipsets and memory modules.
- Flip Chip : Suitable for fluxing needs in high-precision flip chip soldering processes.
- Ball Grid Array (BGA/CSP) : Excellent performance in ball soldering and rework of various ball grid array packages.
FEATURES
| SPECIFICATIONS | ECOFREC POP WS30 |
|---|---|
| Appearance | Light yellow |
| Solubility in water | Soluble |
| Solubility in alcohol | Soluble |
| Density at 20°C | 1.0 |
| Halogen content | No halogen |
| Viscosity (Pa.s at 25°C) Thermoscientific rheometer* | 20 |
*The equipment used is plate/plate mobile 35mm diameter
CHARACTERISTICS
| CHARACTERISTICS | VALUES | METHOD |
|---|---|---|
| Flux Classification | REH1 / 122 | ANSI/J-STD-004 / ISO 9454 |
| Solder balling test | Pass | ANSI/J-STD-005 |
| Copper mirror | H Pass | ANSI/J-STD-004 |
| Copper corrosion major | Pass | ANSI/J-STD-004 |