Inventec, a leader in high-performance packaging technology:Complete semiconductor ball attach solution
Pursuing the highest yield rate, setting a new benchmark for semiconductor packaging.
In the global semiconductor competition, miniaturization and high performance are key. Inventec offers ball attach flux designed for advanced packaging, helping you achieve superior wetting and minimal voiding in BGA, CSP, and Flip-Chip packaging processes, accelerating time-to-market.
Three core advantages: Why choose Inventec?
- Excellent Wetting Performance:
- For a variety of substrate materials and leadframes, our flux formulation ensures that solder balls form a perfect alloy bond during reflow, effectively reducing the risk of non-wetting.
- Ultra-low Residue & Cleanability:
- To meet the stringent cleanliness requirements of advanced packaging, Inventec offers both washable and no-wash solutions. Even in fine-pitch assemblies, it ensures no ion contamination, guaranteeing long-term product reliability.
- Sustainable formulations that align with ESG trends (Green Chemistry):
- We understand the importance Taiwanese companies place on environmental compliance. All our products comply with RoHS 2.0 and REACH regulations, and we offer low-VOC formulations to help you achieve your green supply chain goals.
Ball Attach
Ball bonding is a useful process in the semiconductor manufacturing industry, particularly for attaching solder balls to substrates, wafers, or PCBs—crucial for the production of integrated circuits (ICs) and microelectronic products—and INVENTEC offers specialized solutions to support the performance and reliability of this critical step.
ECOFREC TF48
High viscosity, excellent printing effect
- No need to clean sticky flux
- Flip chip, ball soldering and component rework
- Excellent printing effect and high viscosity
ECOFREC TF49
High viscosity viscous flux
- Halogen-free viscous flux
- Flip Chip and Rework Soldering
- Low residue characteristics
Die Attach
Wafer placement is a critical and highly specialized process in semiconductor manufacturing. INVENTEC provides advanced, innovative, and reliable solutions designed to ensure accurate wafer placement, thereby significantly improving the overall performance, reliability, and long-term durability of devices under a variety of operating conditions.
Flip Chip & CSP
Flip chip and CSP (chip-on-chip) technologies are crucial in SMT solder paste applications because they enable high-density interconnects and improve electrical performance, supporting the miniaturization and enhanced reliability of advanced components—thanks to INVENTEC’s high-quality solder paste solutions that ensure accuracy and consistency.
ECOFREC POP WS30
Water-based viscous flux
- Water-soluble viscous flux
- Preformation and Flip Chip Processes
- Excellent wetting properties
ECOFREC TF48
High viscosity, excellent printing effect
- No need to clean sticky flux
- Flip chip, ball soldering and component rework
- Excellent printing effect and high viscosity
PoP Assembly
PoP (Package Stacking) assembly plays a crucial role in SMT (Surface Mount Technology) solder paste applications. INVENTEC’s advanced solutions ensure precise alignment and reliable soldering of stacked components, thereby improving space utilization and electrical performance of compact electronic devices.
ECOREL HT 301T
High-temperature lead-containing solder paste
- Pb93,5Sn5Ag1,5 lead-containing solder paste
- No cleaning of the printing process
- Low porosity and high reliability
ECOFREC POP WS30
Water-based viscous flux
- Water-soluble viscous flux
- Preformation and Flip Chip Processes
- Excellent wetting properties
System-in-Package (SIP)
System-in-Package (SiP) technology significantly enhances the application of SMT solder paste by seamlessly integrating multiple components into a single compact package. INVENTEC provides advanced and reliable soldering solutions to improve the performance, durability, and overall reliability of a wide range of modern electronic devices.
Package Assembly
In the packaging and assembly process, semiconductor wafers are encapsulated to ensure mechanical durability and optimal electrical function. INVENTEC’s advanced sintering paste solutions enhance this process, improving connection reliability and thermal management, thereby increasing the performance and lifespan of semiconductor devices.
Semiconductor Solutions: An Essential Guide to Advanced Soldering and Electronics
Semiconductor solutions play a crucial role in the assembly of high-performance electronic devices. By utilizing advanced soldering techniques, manufacturers can ensure reliable electrical connections , good thermal efficiency , and long-term component stability . Combining
semiconductor components with precision industrial soldering solutions improves production efficiency, reduces defect rates, and enhances overall system performance. These solutions are essential for applications with extremely high reliability requirements, such as electric vehicles , aerospace electronics , and medical devices .
semiconductor components with precision industrial soldering solutions improves production efficiency, reduces defect rates, and enhances overall system performance. These solutions are essential for applications with extremely high reliability requirements, such as electric vehicles , aerospace electronics , and medical devices .
Benefits and Applications
Core advantages
Semiconductor solutions enable precise soldering in advanced processes such as wafer mounting, ball bonding (CSP, BGA), flip chip, wafer bumping, POP, and SIP. These semiconductor soldering solutions improve yield, reduce defects, and ensure consistent electrical and mechanical reliability throughout semiconductor packaging and assembly processes.
Technical aspects
Semiconductor soldering requires precise control of temperature profiles, alloy composition, and flux chemistry to achieve optimal wetting and minimize voids or bridging. Specialized semiconductor fluxes and low-residue solder paste formulations are designed to meet the stringent cleanliness and reliability requirements of the microelectronics industry.
Application areas
Semiconductor solutions are widely used in automotive electronics, aerospace and defense, medical devices and other fields. They ensure high-quality soldering of microchips, power components and advanced semiconductor assemblies, while supporting high-volume, high-precision manufacturing processes.
Semiconductor solutions for the automotive industry
In electric and hybrid vehicles, semiconductor solutions are used in power electronics, battery management systems, and vehicle control units. Reliable soldering processes ensure stable electrical performance and thermal management in high-voltage applications.
Semiconductor solutions for aerospace and defense
For aerospace electronics and defense systems, semiconductor solutions enable the precision soldering of avionics, radar, and satellite components. High-reliability soldering techniques are crucial in extreme temperature and vibration environments.
Semiconductor solutions for the medical industry
In the field of medical devices, semiconductor solutions enable precise soldering of imaging sensors, diagnostic systems, and patient monitoring equipment, thereby ensuring reliable electrical connections and long-term device performance.