ECOFREC™ TF48 No-Clean Soldering Flux A leading solution for improving Flip Chip packaging yield and process efficiency
Leading the way in semiconductor packaging and assembly: superior lead-free no-clean flux.
Tailor-made for high-reliability electronic products, it combines excellent wettability with extremely clean, transparent residue to optimize automated optical inspection.
Three core advantages: Why choose Inventec?
- Halogen-free formula : Meets the highest environmental standards, ensuring the safety of electronic assembly.
- Excellent wetting properties : Exhibits superior welding performance on a variety of surface treatments (such as OSP, Ni/Au).
- Transparent residue : There is very little residue after welding and it is completely transparent, requiring no cleaning and significantly improving AOI inspection efficiency.
- High stability : Excellent anti-slumping performance, preventing bridging short circuits.
Core Product Advantages
ECOFREC™ TF48 is a high-viscosity solder paste developed specifically for electronic assembly and packaging processes, and is particularly suitable for precision components that require precise positioning.
- Superior component gripping ability: It has strong and long-lasting adhesion, which can effectively prevent BGA balls or small components from shifting during transfer or reflow soldering.
- Excellent wetting ability: Designed to handle a variety of surface treatments (such as tin-lead, lead-free, Ni/Au, etc.), it can quickly remove oxide layers and ensure that the solder joints form a perfect alloy layer.
- Transparent residue: There is very little residue after welding, and it is completely transparent, which does not affect the accuracy of automated optical inspection (AOI).
Safety & Environmental Commitment
In response to Taiwan’s increasingly stringent environmental regulations and workplace safety requirements, TF48 offers the safest option.
- Halogen-free certification: Fully compliant with international green product standards, belonging to ROL0 level (halogen-free, rosin-free surfactant), reducing the impact on the environment and circuits.
- Chemical stability: It adopts a stable chemical formula, the residue after welding is not corrosive, and it has extremely high surface insulation resistance (SIR), so there is no risk of leakage during long-term use.
- Compliant with REACH and RoHS: Ensuring the supply chain meets global compliance requirements and helping customers expand into international markets.
Exceptional Performance
In the pursuit of miniaturization in semiconductor manufacturing processes, TF48 improves production yield due to its physical stability.
- Multiple dispensing/printing methods: Excellent consistency can be demonstrated whether it is through needle dispensing , screen printing or dipping process.
- Long working life: It can maintain its viscosity and activity for a long time when exposed to air, making it suitable for highly automated continuous production lines.
- Reduce solder ball formation: The exclusive formula effectively suppresses spatter and solder ball defects during the soldering process.
Cost optimization
By reducing scrap and saving process steps, production costs can be directly optimized.
- Truly No-Clean: The residue is physically stable, eliminating the need for expensive cleaning processes and equipment, and saving on water and chemical solvent costs.
- Improved Rework Success Rate: In BGA or QFN rework, extremely high activity ensures successful soldering on the first attempt, significantly reducing thermal damage to the PCB caused by secondary heating.
- Reduce material waste: It has good stability and is less prone to deterioration even when stored at room temperature, thus extending the product’s lifespan.
Application area
ECOFREC™ TF48 is the best soldering solution for the following applications in Taiwan’s electronics supply chain:
- BGA/CSP Rework and Repair: The first choice for professional repair shops and SMT production lines to replace and repair large-size ball array packages.
- Flip Chip Packaging: Suitable for chip bumping in high-density packaging.
- Ball Attach: Provides strong holding force and soldering flux for placing balls on semiconductor substrates.
- Precision assembly: for micro-components that are extremely sensitive to residues, such as sensors and camera lens modules.
FEATURES
| SPECIFICATIONS | ECOFREC TF48 |
|---|---|
| Flux appearance | Amber |
| Density at 20°C (g/cm³) | 1 |
| Solubility in water | Not soluble |
| Solubility in alcohol | Soluble |
| Halogen content | No halogen |
| Viscosity (Pa·s at 20°C) (Brookfield RVT TF at 5 RPM) | 350 – 550 |
CHARACTERISTICS
| STANDARDS TESTS | RESULTS | PROCEDURES |
|---|---|---|
| Flux classification | ROL0 | ANSI/J-STD-004 |
| SIR / Electromigration (IPC) | Pass | ANSI/J-STD-004 |
| Bono corrosion test 85°C / 85% RH – 15 days | Pass: Fc < 1% | Inventec MO.SB.10029 |
| Chromate paper | Pass | ANSI/J-STD-004 |
| Copper mirror | Pass | ANSI/J-STD-004 |