ECOFREC™ TF49:Halogen-free no-clean viscous flux—the perfect balance between superior yield and a clean process.
In the world of high-density packaging and precision rework, even minute residues can affect the long-term reliability of a product. The ECOFREC™ TF49 from Inventec, France , is designed for SMT production lines seeking ultimate stability, providing a comprehensive solution from ball repositioning and flip-chip installation to precision repair.
High viscosity, excellent printing effect
- No need to clean sticky flux
- Flip chip, ball soldering and component rework
- Excellent printing effect and high viscosity
Core Product Advantages
ECOFREC™ TF49 is a solder paste designed to meet the challenges of miniaturization and lead-free production in modern electronics , offering exceptional physical stability.
- Excellent thermal stability: Designed specifically for lead-free alloys (such as SAC305), it maintains excellent activity during high-temperature reflow soldering cycles and does not easily decompose.
- Strong Tackiness: With an ideal viscosity profile, it can firmly lock onto tiny BGA solder balls or components, effectively solving the problem of displacement caused by vibration.
- Excellent wetting and deoxidation: Even with micro-coating, it can quickly remove the oxide layer on the metal surface, ensuring the high mechanical strength and conductivity of the solder joint.
Safety & Environmental Commitment
TF49 offers a cleaner alternative to the stringent chemical controls imposed by Taiwan’s high-end OEM systems (such as TSMC’s supply chain related packaging).
- ROL0 Halogen-Free Grade: Completely free of halogen activators (compliant with ANSI/J-STD-004 standards), avoiding the risk of electrochemical migration (ECM) on circuit boards from the source.
- Minimal Residues: Very little residue is left after soldering and it is highly chemically inert, so there is no need to worry about corrosion of fine-pitch components.
- Environmentally friendly standards: Fully compliant with RoHS and REACH regulations, helping Taiwanese customers easily connect to advanced green supply chains in Europe and the United States.
Exceptional Performance
For Taiwan’s highly automated SMT and packaging lines, the TF49 provides stable process performance.
- Versatile application adaptability: Whether it’s needle dispensing , stencil printing , or component dipping , it exhibits excellent coating consistency.
- Exceptional printing resolution: Designed for fine-pitch components, it effectively prevents flux from penetrating into areas that should not be covered, reducing the risk of short circuits.
- Extra-long working window: It has excellent dryness resistance and can maintain its stickiness on the surface of steel plates or parts for a long time, making it suitable for highly complex assembly processes.
Cost optimization
By reducing defect rates and simplifying post-processing, production efficiency is directly improved.
- No-Clean: High reliability. The residue is non-hygroscopic and transparent, eliminating the need for complicated cleaning, drying, and wastewater treatment processes.
- Reduce voiding: The exclusive venting formula helps to expel gases during reflow soldering, reducing voiding inside solder balls and minimizing product rework and customer complaints.
- Improve yield: Reduce solder balling and uneven soldering, and optimize the “first-pass yield” that is most valued by Taiwanese electronics foundries.
Application area
ECOFREC™ TF49 is a key material for Taiwan’s semiconductor packaging and testing and high-end computer industries:
- Flip Chip: Designed specifically for the dip-dip process of chip bumping.
- BGA/CSP Ball Repositioning and Repair: Providing a more reliable soldering and rework environment for lead-free BGA components.
- SiP (System-in-Package): Designed for the high-precision soldering requirements of tiny components in heterogeneous integration technology.
- Automotive and medical electronics: key areas that meet extremely high requirements for residue stability and long-term electrical performance.
FEATURES
| SPECIFICATIONS | ECOFREC TF49 |
|---|---|
| Appearance | Light yellow |
| Solubility in water | Insoluble |
| Solubility in alcohol | Soluble |
| Density at 20°C | 1.0 |
| Halogen content | No halogen |
| Viscosity (Pa.s at 20°C) (Brookfield RVT TF at 5 RPM) | 300–500 |
CHARACTERISTICS
| CHARACTERISTICS | VALUES | METHOD |
|---|---|---|
| Flux classification | ROL0 | ANSI/J-STD-004 |
| Copper mirror | Pass | ANSI/J-STD-004 |
| Chromate paper | Pass | ANSI/J-STD-004 |
| SIR (IPC) | Pass | ANSI/J-STD-004 |
| Bono Corrosion test (85°C / 85% HR – 15 days) | Pass: Fc < 1% | Inventec MO.SB.10029 |