ECOREL™ FREE 300-31A: Ultra-low void lead-free solder paste specifically developed for power electronics and semiconductor packaging
Superior gas emission technology and thermal conductivity provide an extremely reliable soldering solution for DCB substrates and large power components.
Core features
- Patented Ultra-Low Voiding technology: Designed specifically for large-area heat conduction needs, it can minimize the void ratio and significantly improve the heat dissipation efficiency of components.
- Excellent continuous printing stability: It has excellent rheological properties and can maintain stable printing accuracy even under long-term SMT production line operation.
- High-reliability no-clean residue: The post-soldering residue is transparent and has high insulation resistance, meeting the most stringent electrochemical migration (ECM) test standards.
Core Product Advantages
In semiconductor and power module assembly, material stability is the cornerstone of quality. ECOREL™ FREE 300-31A provides a chemical system that is both easy to use and provides long-term stability.
- Long Stencil Life: Offers over 8 hours of stencil operation time, reducing production interruptions caused by solder paste drying.
- Transparent residue: The residue after soldering is minimal and completely transparent, facilitating the interpretation of solder joints by automated optical inspection (AOI).
- Optimized wetting kinetics: Exhibits excellent wetting power on a variety of substrates (such as copper, nickel/gold) to ensure the physical strength of the joint surface.
Safety & Environmental Commitment
Inventec is committed to advancing green semiconductor manufacturing processes, and the 300-31A is designed to fully comply with the world’s most stringent environmental compliance standards.
- Compliant with RoHS 2.0 standards: completely lead-free, helping customers successfully sell their products in the global market.
- Halogen-free formula: Employs truly halogen-free chemical technology to reduce environmental burden and corrosion risks.
- Low VOC emissions: Releases extremely low levels of chemical fumes during reflow soldering, providing a healthier working environment.
Excellent performance
Facing the challenges of high power density and thermal stress, this product demonstrates exceptional structural stability, ensuring the long-term durability of electronic products.
- Excellent heat dissipation path: By reducing the voids inside the solder layer, it is ensured that the heat generated by the power components can be quickly conducted to the substrate.
- Anti-offset performance: Effectively prevents small components from shifting or tilting during surface mount and reflow soldering processes.
- High thermal cycling resistance: The weld joint structure is tough and can withstand the frequent hot and cold stresses in automobiles or industrial equipment.
Cost optimization
Improved process efficiency and reduced defect rates directly translate into increased profits for our customers.
- Reduce scrap rate: With stable low void performance, reduce power component burnout or returns due to poor heat dissipation.
- Simplified process: No chemical cleaning steps are required after welding, saving a lot of water resources, chemical costs and energy consumption.
- High production capacity compatibility: A wide reflow soldering temperature profile window reduces the difficulty of machine setup and shortens the product launch preparation time.
Application area
This product is widely used in cutting-edge industries that require handling high voltage, high current, and extremely high reliability.
- Power Modules: Perfect for IGBT modules, MOSFET packages, and DCB/AMB substrate bonding.
- Electric vehicle inverters (EV Inverters): meet the stringent standards of electric vehicle powertrains for power conversion efficiency and heat dissipation.
- Renewable energy systems: Applied to solar inverters and wind power generation control systems to ensure long-term stability in harsh outdoor environments.
FEATURES
| SPECIFICATIONS | ECOREL FREE 300-31A |
|---|---|
| Alloy | Sn96,5Ag3.5 |
| Melting point (°C/°F) | 221°C / 426°F |
| Metal content (%) | 89 +/- 0,5 |
| Post reflow residues | Approximately 5% by w/w |
| Halogen content | No Halogen |
| Powder size | 25–45 microns / Type 3 |
| Spiral pump Viscosity (Pa.s 25°C) | Typical 145 |
*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.
CHARACTERISTICS
| CHARACTERISTICS | VALUES | TEST METHOD |
|---|---|---|
| Flux Classification | ROL0 | ANSI/J-STD-004 |
| Flux Classification | 113 | ISO 9454 |
| Solder balling test | Pass | ANSI/J-STD-005 |
| Copper mirror | Pass | ANSI/J-STD-004 |
| Copper corrosion | Pass | ANSI/J-STD-004 |
| SIR (IPC) | Pass | ANSI/J-STD-004 |
| SIR (Bellcore) | Pass | Bellcore |
| Electromigration (IPC / Bellcore) | Pass | ANSI/J-STD-004 / Bellcore |
| Bono Corrosion test (85°C / 85% HR – 15 days) | Pass Corrosion Factor <8% | Inventec procedure |