ECOREL™ FREE 305-31A : High-reliability lead-free solder paste designed specifically for semiconductor packaging and power electronics
Exceptional low void ratio and wetting properties enable perfect bonding of large-size power device wafers to the DCB substrate.
Core features
- Extremely low voiding: Designed for large-area soldering, ensuring maximum thermal and electrical conduction between the DCB substrate and the large chip.
- Excellent copper wettability: It has a strong spreading ability on copper surfaces, effectively inhibits oxidation and keeps solder joints bright.
- No-Clean chemical formula: extremely low residue and chemically neutral, no post-soldering cleaning required, and maintains a stable solder paste thickness (BLT).
Core Product Advantages
In the highly competitive semiconductor market, consistent material quality is key to improving yield. Ecorel™ Free 305-31A combines highly reliable chemistry to ensure superior performance in complex SMT processes.
- High-reliability formulation: Continuing the high-reliability chemical foundation of the Ecorel family, it is specially optimized for the miniaturization trend of components.
- Excellent solder joint appearance: Effectively inhibits discoloration caused by copper oxidation, providing bright solder joints with good visual inspection performance.
- Optimized solder layer thickness (BLT): Precisely control solder paste rheology to ensure uniform soldering height between large-size wafers and substrates.
Safety & Environmental Commitment
We are well aware of the importance that the semiconductor supply chain places on environmental responsibility, and from the very beginning of the research and development of this product, we have regarded human health and global environmental regulations as the highest principles.
- Halogen-free: Fully compliant with green environmental protection standards, reducing the emission of harmful substances during the production process.
- Lead-free: Uses SAC305 alloy, compliant with RoHS and mainstream international semiconductor industry standards.
- Free of CMR substances: Contains no carcinogenic, teratogenic, or reproductive toxic substances, ensuring the safety of frontline workers.
Exceptional Performance
This solder paste demonstrates mechanical and electrical performance that exceeds standards, addressing the challenges of high thermal loads in power semiconductors.
- Ultimate thermal management: By achieving extremely low void performance, the heat dissipation efficiency of power components is greatly improved, extending product life.
- Reduced spatter and bridging: Special chemical flux design minimizes solder ball spatter and micro-short circuit risks.
- Stable printing performance: It can maintain stable demolding and printing accuracy even during long-term continuous production.
Cost optimization
By simplifying the manufacturing process and improving the first-pass yield, we help customers gain an advantage in total cost of ownership (TCO).
- Improve First Pass Yield: Due to the excellent wettability of copper, it can significantly reduce rework costs caused by poor soldering.
- Saves on cleaning processes: Highly stable, no-clean residue eliminates the need for expensive subsequent cleaning equipment and chemical solutions.
- Reduced wire bonding defects: Optimized surface treatment reduces the risk of failure in subsequent wire bonding processes.
Application areas
This product was developed to address the most challenging application scenarios in the modern electronics industry.
- Power Electronics: Tailor-made for DCB (Direct Copper Clad) substrates and high-power semiconductor device packaging.
- Automotive electronics: Meets automotive-grade reliability requirements for high vibration and high thermal cycling.
- Industrial power control: Suitable for power transmission modules that require extremely high tolerance, such as frequency converters and servo power supplies.
FEATURES
| SPECIFICATIONS | ECOREL FREE 305-31A |
|---|---|
| Alloy | Sn96,5Ag3Cu0.5 |
| Melting point (°C/°F) | 217°C / 422°F |
| Metal content (%) | 89 ± 0.5 |
| Post reflow residues | Approximately 5% by w/w |
| Halogen content | No Halogen |
| Powder size | 25–45 microns / Type 3 |
| Spiral pump Viscosity (Pa.s 25°C) | Typical 145 |
*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.
CHARACTERISTICS
| CHARACTERISTICS | VALUES | TEST METHOD |
|---|---|---|
| Flux Classification | ROL0 | ANSI/J-STD-004 |
| Flux Classification | 113 | ISO 9454 |
| Solder balling test | Pass | ANSI/J-STD-005 |
| Copper mirror | Pass | ANSI/J-STD-004 |
| Copper corrosion | Pass | ANSI/J-STD-004 |
| SIR (IPC) | Pass | ANSI/J-STD-004 |
| SIR (Bellcore) | Pass | Bellcore |
| Electromigration (IPC / Bellcore) | Pass | ANSI/J-STD-004 / Bellcore |
| Bono Corrosion test (85°C / 85% HR – 15 days) | Pass – Corrosion Factor <8% | Inventec procedure |