ECOREL™ HT 301T High Temperature High Lead Solder Paste: Driving the thermal limits of next-generation power semiconductors
Designed specifically for Taiwan’s semiconductor packaging and power modules, it achieves ultra-low voiding and extreme thermal stability, facilitating the efficient assembly of wide bandgap semiconductors such as SiC/GaN and IPM modules.
Core features
- High melting point: 296°C – 301°C, suitable for step soldering.
- Low porosity: Significantly improves heat dissipation efficiency and reduces the risk of component failure.
- No-Clean: ROL0 rating, extremely low residue, simplified manufacturing process.
- Excellent wettability: Optimized for various leadframes such as NiAu, NiP, and Cu.
Core Product Advantages
ECOREL™ HT 301T is a high-temperature, high-lead solder paste (Pb93.5/Sn5/Ag1.5) designed specifically for power semiconductor packages to address connectivity challenges in extreme thermal environments.
- Ultimate thermal conductivity: Through patented flux technology, an ultra-low voiding ratio is achieved, ensuring the optimal thermal path between the chip and the substrate and preventing localized overheating.
- Step Soldering is ideal for multi-step packaging processes, with melting points as high as 296°C – 301°C, maintaining structural integrity during subsequent reflow soldering.
- Excellent wettability: It exhibits strong adhesion to a variety of metal surfaces (such as Ni/Au, Ni/P, Cu), ensuring the mechanical strength of the solder joint.
Safety & Environmental Commitment
While pursuing performance, we are committed to providing materials that comply with modern corporate ESG standards and ensure employee health.
- Halogen-free formula: ROL0 graded, halogen-free, reducing the environmental impact of chemicals.
- Employee health is our top priority: We use No CMR flux ingredients (free of carcinogens, mutagens, or reproductive toxins) to provide a safer working environment.
- Extremely low residue: No-Clean residue is transparent and non-corrosive, and passes the stringent SIR surface insulation resistance test, ensuring long-term stable operation.
Exceptional Performance
Optimize high-precision automated production lines to reduce process variables and improve yield.
- Stable printing performance: It has excellent rollability and release properties, and can maintain a consistent amount of solder paste even during long-term continuous printing .
- Stencil Life: The machine can maintain operational activity for more than 8 hours on the steel plate, reducing material waste caused by downtime.
- Extremely wide reflow window: compatible with multiple heating curves, easily handling even high heat capacity power modules.
Cost optimization
We not only provide materials, but also assist you in optimizing your manufacturing processes to maximize economic benefits.
- Simplified process steps: It features efficient cleaning-free technology, which can save the cost of expensive post-cleaning equipment and solvents.
- Improve First Pass Yield: Significantly reduce rework costs and scrap rates with extremely low void and solder ball rates.
- Long shelf life: Optimized chemical stability makes it easy to store and reduces inventory management difficulty.
Application area
ECOREL™ HT 301T is the best partner for Taiwan’s core high-tech industries:
- Power semiconductors: such as MOSFETs, IGBTs, and die attach.
- Automotive Electronics: Meets automotive-grade reliability requirements for high vibration and high temperature difference environments.
- Wide bandgap semiconductors (SiC/GaN): addressing the heat dissipation challenges posed by the high power density of third-generation semiconductors.
- Power Management Module (IPM/PIM): The best solution for integrating industrial-grade power supplies and AI server power supplies.
FEATURES
| SPECIFICATIONS | ECOREL HT 301T |
|---|---|
| Alloy | Pb93,5Sn5Ag1,5 |
| Melting point (°C/°F) | 296–301°C / 565–574°F |
| Metal content (%) | 90 |
| Post reflow residues | Approximately 3% by w/w |
| Halogen content | No Halogen |
| Powder size | 25–45 microns / Type 3 |
| Spiral pump Viscosity (Pa.s 25°C) | Typical 75 |
*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.
CHARACTERISTICS
| CHARACTERISTICS | VALUES | TEST METHOD |
|---|---|---|
| Flux Classification | ROL0 | ANSI/J-STD-004 |
| Flux Classification | 113 | ISO 9454 |
| Solder balling test | Pass: Fc < 1% | ANSI/J-STD-005 |
| Copper mirror | Pass | ANSI/J-STD-004 |
| Copper corrosion | Pass | ANSI/J-STD-004 |
| SIR (IPC) | Pass | ANSI/J-STD-004 |
| SIR (Bellcore) | Pass | Bellcore |
| Electromigration (IPC / Bellcore) | Pass | ANSI/J-STD-004 / Bellcore |