ECOREL™ SINTEC AP90: Ultra-low void lead-free solder paste specifically developed for power electronics and semiconductor packaging
Breakthrough ultra-low void technology, combined with a highly reliable chemical formula, provides optimized thermal management solutions for IGBTs, MOSFETs, and DCB packages.
Core features
- Extreme Low Voiding: Designed specifically for large-area thermally conductive interfaces, it significantly reduces void ratio, ensuring the thermal conductivity of electrical components under high loads.
- Exceptional Bono corrosion test performance: Passes a rigorous 15-day test at 85°C / 85% RH to ensure the chemical safety of post-soldering residues on circuits under extreme conditions.
- High-reliability metal alloy: Paired with SAC305 alloy, it provides excellent mechanical strength and resistance to thermal fatigue, extending product life.
Core Product Advantages
In semiconductor packaging processes, AP90 is not only a soldering material, but also a key pillar for improving system reliability.
- Long-lasting antioxidant capacity: Even during long preheating or reflow processes, the solder paste can maintain its activity, ensuring bright and full solder joints.
- Optimized chemical stability: Excellent wettability is achieved through a patented flux system, especially on copper and nickel/gold plated surfaces.
- Stable BLT (Bond Line Thickness): Precisely controls the solder layer thickness to ensure physical stability and thermal conductivity consistency between components.
Safety & Environmental Commitment
For advanced applications, chemical stability is just as important as environmental responsibility. SINTEC AP90 not only meets but exceeds safety standards.
- Bono Test Validation Beyond IPC: Passing a 15-day (360-hour) 85°C/85% RH test, the corrosion factor is far below the standard, ensuring no risk of ion migration and corrosion between electrodes.
- Halogen-free and RoHS compliant: Meets global green supply chain standards and is completely free of halogens, lead and other CMR substances.
- Transparent neutral residue: The residue after soldering is chemically neutral and will not deteriorate or damage sensitive electronic components over time.
Exceptional Performance
Designed specifically for semiconductor applications involving high frequency, high current, and high heat generation.
- Industry-leading gas emission efficiency: The special exhaust design effectively reduces residual bubbles during recirculation and minimizes void area.
- Excellent compatibility with automated optical inspection (AOI): Minimal and transparent residue significantly reduces the chance of AOI misjudgment and improves production line efficiency.
- Extensive process view: adaptable to various reflow soldering profiles, providing engineers with greater process flexibility.
Cost optimization
By reducing failure risks and simplifying processes, it creates substantial economic benefits for businesses.
- Improved thermal conductivity yield: Reduced voids mean a lower component overheating failure rate, reducing the risk of customer returns and compensation.
- Advantages of no-wash process: Highly reliable residue eliminates the need for subsequent cleaning costs, shortens the production process, and reduces wastewater treatment costs.
- Extremely low splatter characteristics: Reduces short circuits and rework costs caused by solder ball splatter, and optimizes first pass yield.
Application area
This product is designed for future high-end power transmission and conversion equipment.
- IGBTs and power modules: Provide the highest stability for the bonding of large chips and heat sinks (DCB/AMB).
- Electric Vehicle (EV) Powertrain: Meets the stringent requirements of the On-Board Charger (OBC) and Main Inverter for heat dissipation and vibration resistance.
- Aerospace and Defense Electronics: Certified for long-term reliability by Bono Test, suitable for high-end control systems in extreme environments.
FEATURES
| SPECIFICATIONS | ECOREL SINTEC AP90 |
|---|---|
| Alloy | Ag + additives |
| Sintering temperature (°C/°F) | Typically 250°C / 482°F |
*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.
CHARACTERISTICS
| PERFORMANCE | ECOREL SINTEC AP90 |
|---|---|
| Shear Strength | Up to 95 MPa |
| Heat Conduction | >300 W/mK |
| Electric conductivity | 40 MS/m |