ECOREL™ SINTEC AP90D: Low-pressure silver sintering paste specifically designed for large-area dispensing processes
It surpasses the limits of traditional solders, providing superior thermal management and long-term reliability for SiC and GaN high-power semiconductor modules.
Core features
- Large-area packaging optimization : Designed specifically for flat-bed dispensing, supporting chip sizes up to 400mm² and bonding to large-area substrates.
- Extremely high thermal conductivity : It has an excellent thermal conductivity of more than 350 W/mK, which significantly improves heat dissipation efficiency and extends product life.
- Excellent storage stability : It can be stored at room temperature without changing its properties, simplifying logistics and reducing warehousing costs.
Core Product Advantages
Through innovative silver sintering technology, we have achieved an unprecedented balance between electrical connectivity and mechanical strength, ensuring that semiconductor components remain stable even in extreme environments.
- Ultra-high shear strength : Shear strength up to 90 MPa, ensuring extremely high mechanical reliability of the joint under thermal stress.
- Overall surface compatibility : It exhibits excellent wetting properties on surfaces such as DCB materials, gold (Au), nickel (Ni), copper (Cu), and silver (Ag).
- High conductivity : With a conductivity of ~40 MS/m, it optimizes electrical signal transmission and reduces power loss.
Safety & Environmental Commitment
We are committed to promoting green electronics manufacturing, and all product development prioritizes minimizing environmental impact and ensuring the health of operators.
- Halogen-free and nanoparticle-free : The formula is free of halogens and nanoparticles, meeting the high standards of environmental protection and human health required by the modern electronics industry.
- Compliant with RoHS and REACH regulations : Free from harmful substances such as lead, cadmium, and mercury, and free from CMR (carcinogenic, mutagenic, and reproductive toxic) components.
- Non-hazardous goods transportation : Because the formula is stable and does not contain hazardous ingredients, the transportation process is safe, convenient and does not require special declaration.
Exceptional Performance
To meet the demands of wide-bandgap semiconductors, this sintering paste can withstand more stringent operating settings, improving overall system performance.
- High temperature cycling test : Passed TCT temperature cycling test (-55°C to +125°C) with more than 1,000 cycles.
- Wide bandgap material compatibility : Fully compatible with the operating temperature and mission profiles of silicon carbide (SiC) and gallium nitride (GaN).
- 100% pure silver solidification : After sintering, a 100% silver content junction is formed, ensuring that the junction has the stability of pure metal.
Cost optimization
Simplifying the process not only shortens time to market, but also enhances a company’s competitiveness by reducing material waste and lowering equipment maintenance costs.
- One-stop sintering process : Supports single-step sintering of the entire module, greatly simplifying the assembly process.
- Extremely low material waste : Compared to traditional printing processes, dispensing can precisely control the amount used, significantly reducing waste paste.
- Advantages of room temperature storage : No refrigeration equipment is required, reducing energy consumption and maintenance costs of special logistics facilities.
Application area
With its high reliability and powerful heat treatment capabilities, the AP90D has become the preferred solution in many high-end industrial fields.
- Automotive industry : Power inverters and powertrain modules for electric vehicles (EVs).
- Energy and Renewable Energy : Applied to high-power wind power converters, solar inverters and other power electronic equipment.
- Aerospace : Providing long-lasting and reliable connectivity solutions under harsh temperature and vibration conditions.
FEATURES
| SPECIFICATIONS | ECOREL SINTEC AP90D |
|---|---|
| Alloy | Ag + additives |
| Sintering temperature (°C/°F) | Typically 250°C / 482°F |
CHARACTERISTICS
| PERFORMANCE | ECOREL SINTEC AP90D |
|---|---|
| Shear Strength | Up to 90 MPa |
| Heat Conduction | >350 W/mK |
| Electric conductivity | ~40 MS/m |