ECOREL™ SINTEC XP95 : Leading the way in pressureless silver sintering solutions for high-power semiconductor packaging
Combining excellent thermal conductivity with dispensing flexibility, this is a no-clean, pressureless sintering technology specifically designed for SiC and GaN power modules.
Core features
- Pressureless sintering capability : Supports sintering under pressureless conditions, suitable for pressure-sensitive precision components.
- Excellent heat dissipation performance : Provides a thermal conductivity of up to 200 W/mK , effectively solving the risk of thermal runaway of high-power components.
- Wide bandgap material compatibility : Fully meets the high-temperature operation requirements of next-generation semiconductors such as silicon carbide (SiC) and gallium nitride (GaN).
Core Product Advantages
With its high-purity silver content and exclusive additive formula, XP95 sets a new industry standard for electrical and mechanical integration.
- Extremely high shear strength : Under pressureless sintering conditions, the shear strength can still reach more than 50 MPa , ensuring excellent connection stability.
- 100% pure silver solidification : After sintering, a pure silver bonding layer is formed, providing electrical and thermal conductivity properties similar to those of a bulk material.
- Diverse substrate compatibility : Excellent wetting and adhesion performance on DCB materials, gold (Au), silver (Ag) and copper (Cu) surfaces.
Safety & Environmental Commitment
We are committed to sustainable development, incorporating environmental indicators into the core of product development to help companies achieve their green manufacturing goals.
- Halogen-free and nanoparticle-free : The advanced formula is halogen-free and does not use nanoparticles, reducing potential risks to the environment and human health.
- Compliant with RoHS standards : Strictly limits the content of hazardous substances such as lead, mercury, and cadmium, fully complying with EU environmental directives.
- CMR-free : The product does not contain carcinogenic, mutagenic, or reproductively toxic substances, ensuring the safety of workers.
Exceptional Performance
Designed for extreme temperature environments, the XP95 can maintain the integrity of connection points during prolonged high-load operation.
- High temperature resistance and reliability : Supports operating temperatures above 200°C, meeting the mission profiles of high-power semiconductors.
- Excellent thermal cycling performance : It has excellent resistance to thermal fatigue and can significantly extend the service life of power modules.
- Clean-free process : The residue after sintering is extremely low and non-active, and usually no additional cleaning steps are required.
Cost optimization
Simplify processes and enhance storage flexibility to help customers reduce total cost of ownership (TCO) in a highly competitive market.
- Room temperature storage characteristics : It can be stored and transported at room temperature of 25°C, saving cold chain logistics and expensive low-temperature storage costs.
- All-in-one process : a single-step sintering procedure that shortens the production cycle and reduces equipment investment.
- Minimize dispensing waste : Precise dispensing performance reduces material waste and optimizes BLT (batch thickness) results.
Application area
The versatility of XP95 makes it the best choice for handling high heat flux density packaging in modern high-tech industries.
- Power Electronics : Especially for die-attach of SiC and GaN power modules.
- Electric Vehicles (EVs) : Used in main inverters, on-board chargers (OBCs), and DC-DC converters.
- Renewable Energy : High-efficiency energy management components suitable for wind power and solar energy systems.
FEATURES
| SPECIFICATIONS | ECOREL SINTEC XP95 |
|---|---|
| Alloy | Ag + additives |
| Sintering temperature (°C/°F) | Typically 250°C / 482°F |
CHARACTERISTICS
| PERFORMANCE | ECOREL SINTEC AP90 |
|---|---|
| Shear Strength | Up to 60 MPa |
| Heat Conduction | >300 W/mK |
| Electric conductivity | 40 MS/m |