ECOREL™ SINTEC XP95D : New generation of high thermal conductivity pressureless sintered silver paste
This highly stable dispensing silver paste is designed specifically for high-power chip bonding and exhibits excellent thermoelectric conductivity in standard reflow soldering equipment without the need for pressure.
Core features
- Pressureless sintering process : Sintering can be completed without applying mechanical pressure, which greatly simplifies the production process.
- Ultra-high thermal conductivity : Thermal conductivity greater than 300 W/mK , providing excellent heat dissipation for wide bandgap semiconductors such as SiC and GaN.
- Nano-Join patented technology : Based on advanced nano-joining technology, it ensures extremely high shear strength and connection stability.
- Room temperature storage friendly : Unlike traditional low-temperature storage adhesives, it can be stored at room temperature without affecting processing performance.
Core Product Advantages
Through patented formulations and high silver content, we ensure the long-term stable operation of semiconductor packaging in extreme environments.
- 100% pure silver solidification : After sintering, the silver content reaches 100%, providing the purest electrical and thermal conductivity path.
- Excellent wettability : It exhibits excellent wetting effects on various DCB and AMB surface treatments such as Cu, Au, and Ag.
- High shear strength : The shear strength reaches approximately 60 MPa, significantly improving the structural reliability of the package.
Safety & Environmental Commitment
Inventec places sustainability at the core of its R&D, providing green and safe chemical solutions for your production lines.
- Halogen-free and non-toxic rice grains : The formula is halogen-free and free of CMR (carcinogenic, teratogenic, and reproductive toxic) substances, protecting the safety of workers.
- Full compliance : Strictly compliant with REACH and RoHS regulations, and fulfilling regulatory obligations for conflict minerals.
- Lead-free design : Completely free of lead, aligning with the global trend of environmentally friendly electronics manufacturing.
Exceptional Performance
It meets the stringent requirements of SiC and GaN wafers for high heat dissipation and high performance curves.
- Extremely low resistivity : conductivity of approximately 40 MS/m , significantly reducing power loss within the package.
- Thermal cycling toughness : Passed more than 1,000 cycles of TCT testing from -55 ℃ to +125 ℃.
- Optimized for high-power applications : Particularly suitable for packaging high-power chips, RF components, and high-power LEDs.
Cost optimization
We help customers reduce capital expenditures (CAPEX) and maximize production capacity without sacrificing quality.
- Standard equipment compatibility : Standard reflow ovens can be used directly, eliminating the need to invest in expensive pressure sintering equipment.
- Extended operating life : With a dispensing life of over 10 hours, reducing downtime for maintenance due to material deterioration.
- Simplify supply chain management : Room temperature storage conditions (25°C) reduce the need for and cost of cold chain logistics and storage environments.
Application area
From automotive electronics to aerospace technology, the XP95D provides robust packaging support.
- Electric vehicles and electric drives : meeting the automotive industry’s high reliability requirements for SiC inverters.
- Automotive Electronics: Meets automotive-grade reliability requirements for high vibration and high temperature difference environments.
- Renewable Energy and Energy Conversion : High-efficiency power module packaging suitable for the energy industry.
- Aerospace and Medical Electronics : Providing long-term stable connectivity in extreme climates or precision medical environments.
CHARACTERISTICS
| CHARACTERISTICS | ECOREL SINTEC XP95D |
|---|---|
| Metal | Ag + binders |
| Sintering temperature | Typically 250°C |
| Metal content (%) | 100% |
PERFORMANCE
| PERFORMANCE | VALUES |
|---|---|
| Shear strength | ~60 MPa |
| Heat conductivity | >300 W/mK |
| Electric conductivity | ~40 MS/m |